Tesla Dojo 3 to Feature 2nm Chips from Samsung with Intel Packaging

rapid Summary

• Tesla is altering the supply chain for its ‘Dojo’ supercomputing chips, moving away from reliance on Taiwan Semiconductor Manufacturing Company (TSMC).
• Samsung will handle front-end manufacturing of Dojo 3 chips using the advanced 2nm process for Tesla’s AI6 and Dojo systems.
• intel will package these chips utilizing EMIB (Embedded Multi-die Interconnect Bridge) 2.5D technology.
• This marks a unique collaboration between two competitors-Samsung and Intel-in chip foundry and packaging processes.
• The chips are designed to unify Tesla’s architecture across Full Self Driving (FSD), robotics, and data center applications.

Indian Opinion Analysis
India has emerged as a rising player in semiconductor manufacturing,but this global collaboration between giants like Samsung,Intel,and Tesla underscores the need for India to accelerate its technological advancement in microchip production processes such as 2nm fabrication and packaging innovation like EMIB. Securing partnerships with global firms could deepen india’s integration into critical supply chains while enabling domestic capabilities in next-generation semiconductor technology design.This shift by Tesla further highlights how diversified collaborations can disrupt customary monopolies within chip manufacturing-a model Indian tech leaders might learn from as they seek international tie-ups.

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