
Xiaomi has announced the Xring O3, its in-house chipset, claiming it scores 52.2 lakh on AnTuTu, the first mobile SoC to cross the 50 lakh mark. The 3nm chip, made by TSMC, features a 10-core CPU and a 16-core G2-Ultra NX GPU. Xiaomi says the CPU performance is 60% better and graphics performance 85% better than its predecessor, with power efficiency up 64%.

The chip will debut in the Xiaomi 18 Fold and Pad 9 Pro Max, launching in September. Bazaar.business today reports Xiaomi also introduced the AI-focused Xring O100 and the automotive Xring D100 chips. GSMarena notes the O3 uses older Arm C1 CPU cores but still beats the Dimensity 9500 in performance and efficiency, coming close to Apple's A19.
GSMarena also reports the O3 was tested on a development board with LPDDR6 RAM, achieving 113.8GB/s bandwidth. The chip has an in-house NPU delivering 200 TOPS. GSMarena mentions reports that Xiaomi is banned from using 2nm TSMC nodes for political reasons, though unconfirmed.
Both sources report the Xring O3's performance claims, but GSMarena adds independent benchmark context from Geekerwan, showing the chip uses older C1 cores and a 3nm node while still competing with newer rivals. Bazaar.business today focuses on Xiaomi's press release, omitting the node limitation and political ban reports. The balanced reading is that Xiaomi has a competitive chip, but its reliance on older process technology and potential node restrictions could limit future generations. The Xiaomi 18 Fold launch in September will test real-world performance.
Coverage: 2 sources, 2 neutral
Sources (2): bazaar.businesstoday.in (neutral report), gsmarena.com (neutral report)
This brief was synthesised by AI from the 2 sources linked above, so one read covers every framing they carry. Methodology and corrections.
Updated: this story now draws on 2 sources.